DuPontTM Green TapeTM 低毓陶瓷系列/低毓生瓷片/低毓生瓷/低毓青

DuPont™ Green Tape™

DuPont™ Green Tape™ material systems meet increasing demands for electronics functioning in extreme heat and other harsh environments. DuPont™ Green Tape™ Low Temperature Co-fire Ceramic (LTCC) is a technology option for designers that combines the benefits of High Temperature Co-fired Ceramic (HTCC) and Thick Film technologies to deliver high density, high reliability, excellent performance, and low cost interconnect packages and substrates.

Key features of DuPont™ Green Tape™ systems:
• Gold, silver, and mixed-metal systems
• Tapes available in several thicknesses
• Cavities & cutouts
• Controlled shrinkage
• Lower cost of total system functionality
• High volume manufacturing
• Compatible with plating
• High yield parallel processing

DuPont™ 951 Green Tape™ System
951 Green Tape™ is Au and Ag compatible, has low TCE, has high strength, refire stability and is a environmentally safe organic binder and solvent system. It is available in four thicknesses and is designed for use as an insulating layer in: RF Modules, Multi-chip Modules, Single Chip Packages, and Ceramic Printed Wiring Boards.


DuPont™ 943 Low Loss Green Tape™ System
This system is ideal for high performance Microwave components requiring highly reliable, small, lighter circuits at a lower total cost of functionality. With a complete offering of gold, silver, and mixed-metal material systems, DuPont™ 943 Low Loss Green Tape™ provides a total solution for high frequency circuit designers and manufacturers.


DuPont™ Green Tape™ 943 System
Overview

Now available is a complete 943 Low Loss Green Tape™ material system with excellent high frequency performance. Modules are produced by cutting dielectric tape to the desired size, punching interconnecting vias, filling vias with thick film compositions, and patterning interconnect lines on the tape. This process is repeated for each layer in the design. Separate layers are collated, stacked, and laminated, becoming the "green" multi-layer. Co-firing the top layer Au and/or Ag-bearing conductors with the multi-layer module provides the lowest possible production cost. Post-fired processing may be used to apply resistors, specialty conductors and dielectrics.

Key features of DuPont™ 943 Green Tape™ system:
The complete DuPont™ 943 Low Loss Green Tape™ LTCC Material System provides a technology option for high frequency applications, enabling high density functionality, excellent reliability, low power requirements and low cost interconnect packaging. Minimal dielectric loss is observed to 77 GHz with additional testing at higher frequencies planned.


The system is composed of a glass/ceramic dielectric tape with shrinkage-matched, high conductivity metallization. Cost-effective parallel processing is an advantage versus the sequential processing associated with thick film hybrids.
Typical applications include:
• Automotive
• Military
• RF and Microwave IC packaging
• Opto-electronics
• Wireless and satellite communications